Duplex Latus agitur Cuprum ffoyle enim HDI
●Crassitudo: 12um 18um 35um 70um
●Vexillum Latitudo: 1290mm, Secare possumus sicut postulationem magnitudinis
●ID: 76 mm
●Longitudo: nativus
●Exemplar suppleri potest;Duc tempus: 7days
●Delivery time: 15-20days
●Stipare singula: Export lignea arca
●Terminus: FOB, CIF.
●Payment item: 50% T/T deposit, statera stipendiorum ante naviculas.
●Princeps perficientur processus dispositionis apparatum fabricandi processus claui aeris.
●Duplex latus tractata Cuprum ffoyle
●Cum princeps vis ligandi ad laminate
●Dirige multi-circulum lamination
●bonum etchability
●Tractata est ffoyle rosea
●Multilayer Typis Circuit Board
●HDI (High Density Interconnector) pro PCB
| Classification | Unitas | Necessitas | Test Methodi | ||||||
| ffoyle Designatio |
| T | H | 1 | 2 | IPC-4562A | |||
| Crassitudine nominatim | um | 12 | 18 | 35 | 70 | IPC-4562A | |||
| Area Pondus | g/m² | 107±5 | 153±7 | 285± 10 | 585± 20 | IPC-TM-650 2.2.12 | |||
| Puritas | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Rdebilitas | Crus latus (Ra) | um | ≤3.0 | IPC-TM-DCL II.2.17 | |||||
| Matte latus (Rz) | um | ≤6 | ≤8 | ≤10 | ≤15 | ||||
| Distrahentes fortitudo | RT(23°C) | Mpa | ≥207 | ≥207 | ≥276 | ≥276 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥103 | ≥103 | ≥138 | ≥138 | |||||
| Prolongatio | RT(23°C) | % | ≥2 | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥2 | ≥2 | ≥2 | ≥3 | |||||
| Resistentia | Ωg/m² | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | IPC-TM-DCL II.5.14 | |||
| Peel fortitudo (FR-IV) | S latus | N/mm | ≥0.9 | ≥0.9 | ≥1.4 | ≥1.4 | IPC-TM-650 2.4.8 | ||
| Lbs/in | ≥5.1 | ≥6.3 | ≥8.0 | ≥8.0 | |||||
| M latus | N/mm | ≥0.9 | ≥1.1 | ≥1.4 | ≥2.0 | ||||
| Lbs/in | ≥5.1 | ≥6.3 | ≥8.0 | ≥11.4 | |||||
| Pinholes & poros | Numeruss | No | IPC-TM-650 2.1.2 | ||||||
| Anti-oxidization | RT(23°C) | diebus | 180 | / | |||||
| H.T.(200°C) | Minuta | 40 | / | ||||||
Standard Width, 1295(±1)mm, Latitudo: 200-1340mm.Ut ex mos peto sartor.
PCB Copper Foil Image
