Ultra Low Profile Copper Foil For 5G High frequency Board

Crassitudo: 12um 18um 35um

Latin Latitudo: 1290mm, Max.latitudo 1340mm;potest secare sicut per magnitudinem petitionem

Sarcina lignea arca


Product Detail

Product Tags

Rudis ffoyle, quae superficies nitida cum ultra humilem asperitatem in utraque parte habet, tractatur de processu proprietatis aeris cum JIMA Micro-aurescens ad altam ancoram observantiam et etiam ultra asperitatem.Magnam observantiam praebet in amplis agris, ex rigidis tabulis impressis circumeundis possessiones transmissionis et fabricationis optimae exemplaris ad flexibiles circuitus qui diaphaneitatis prioritizare.

Features

Ultra humilem profile cum altum cortices vires et bonam SCELERO facultatem.
Hyper Low Crassing technologia, microstructura praestantem materiam efficit applicandi ad altum frequentiae ambitum transmissionis.
In bracteolae tractata rosea est.

Typicam applicationem

Alta frequentia transmissio circuit
Basi statione / Servo
Princeps celeritate digital
PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unitas

Test Methodi

Test methodo

Crassitudine nominatim

Um

12

18

35

IPC-4562A

Area Pondus

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Puritas

%

≥99.8

IPC-TM-650 2.3.15

asperitas

Crus latus (Ra)

m

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte latus (Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

 

Distrahentes fortitudo

RT(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

HT(180°C)

≥180

≥180

≥180

 

Prolongatio

RT(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

HT(180°C)

≥6

≥6

≥6

 

Pinholes & Porosity

Numerus

No

IPC-TM-650 2.1.2

Panguilla fortitudo

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

RT(23°C)

diebus

90

 

RT(200°C)

Minuta

40

 
5G High frequency Board Ultra Low Profile Cupper Foil1

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